10-2513-11H

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Overview of 10-2513-11H

Part Number10-2513-11H
ManufacturerAries Electronics, Inc.
DescriptionCONN IC DIP SOCKET 10POS GOLD
DatasheetsDownload 10-2513-11H Datasheet PDFPDF Icon
Price for 10-2513-11H

Specification of 10-2513-11H

Status
Active
Series
Lo-PRO®file, 513
Package
Bulk
Supplier
Aries Electronics
Type
DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid)
10 (2 x 5)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0in (0.25m)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
10.0in (0.25m)
Contact Material - Post
Brass
Housing Material
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature
-55C ~ 105C

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