10-6621-30

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Overview of 10-6621-30

Part Number10-6621-30
ManufacturerAries Electronics, Inc.
DescriptionCONN IC DIP SOCKET 10POS TIN
DatasheetsDownload 10-6621-30 Datasheet PDFPDF Icon
Price for 10-6621-30

Specification of 10-6621-30

Status
Active
Series
6621
Package
Bulk
Supplier
Aries Electronics
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
10 (2 x 5)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Tin
Contact Finish Thickness - Mating
200.0in (5.08m)
Contact Material - Mating
Phosphor Bronze
Mounting Type
Through Hole, Bottom Entry; Through Board
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
200.0in (5.08m)
Contact Material - Post
Phosphor Bronze
Housing Material
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature
-55C ~ 105C

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