1109681-318

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Overview of 1109681-318

Part Number1109681-318
ManufacturerAries Electronics, Inc.
DescriptionCONN IC DIP SOCKET 28POS GOLD
DatasheetsDownload 1109681-318 Datasheet PDFPDF Icon
Price for 1109681-318

Specification of 1109681-318

Status
Active
Package
Bulk
Supplier
Aries Electronics
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
28 (2 x 14)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0in (0.25m)
Contact Material - Mating
Brass
Mounting Type
Through Hole
Features
Spacer
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin-Lead
Contact Finish Thickness - Post
200.0in (5.08m)
Contact Material - Post
Brass
Housing Material
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature
-

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