18-8750-310C

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Overview of 18-8750-310C

Part Number18-8750-310C
ManufacturerAries Electronics, Inc.
DescriptionCONN IC DIP SOCKET 18POS GOLD
DatasheetsDownload 18-8750-310C Datasheet PDFPDF Icon
Price for 18-8750-310C

Specification of 18-8750-310C

Status
Active
Series
8
Package
Bulk
Supplier
Aries Electronics
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
18 (2 x 9)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
30.0in (0.76m)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame, Elevated
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
10.0in (0.25m)
Contact Material - Post
Brass
Housing Material
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature
-55C ~ 105C

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