20-3508-211

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Overview of 20-3508-211

Part Number20-3508-211
ManufacturerAries Electronics, Inc.
DescriptionCONN IC DIP SOCKET 20POS GOLD
DatasheetsDownload 20-3508-211 Datasheet PDFPDF Icon
Price for 20-3508-211

Specification of 20-3508-211

Status
Active
Series
508
Package
Bulk
Supplier
Aries Electronics
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
20 (2 x 10)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
30.0in (0.76m)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Open Frame
Termination
Wire Wrap
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
10.0in (0.25m)
Contact Material - Post
Brass
Housing Material
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature
-55C ~ 125C

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