20-823-90T

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Overview of 20-823-90T

Part Number20-823-90T
ManufacturerAries Electronics, Inc.
DescriptionCONN IC DIP SOCKET 20POS TIN
DatasheetsDownload 20-823-90T Datasheet PDFPDF Icon
Price for 20-823-90T

Specification of 20-823-90T

Status
Active
Series
Vertisockets™ 800
Package
Bulk
Supplier
Aries Electronics
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
20 (2 x 10)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Tin
Contact Finish Thickness - Mating
200.0in (5.08m)
Contact Material - Mating
Phosphor Bronze
Mounting Type
Through Hole, Right Angle, Horizontal
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
200.0in (5.08m)
Contact Material - Post
Phosphor Bronze
Housing Material
Polyamide (PA46), Nylon 4/6
Operating Temperature
-55C ~ 105C

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