24-3553-16

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Overview of 24-3553-16

Part Number24-3553-16
ManufacturerAries Electronics, Inc.
DescriptionCONN IC DIP SOCKET ZIF 24POS
DatasheetsDownload 24-3553-16 Datasheet PDFPDF Icon
Price for 24-3553-16

Specification of 24-3553-16

Status
Active
Series
55
Package
Bulk
Supplier
Aries Electronics
Type
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
24 (2 x 12)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Nickel Boron
Contact Finish Thickness - Mating
50.0in (1.27m)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Nickel Boron
Contact Finish Thickness - Post
50.0in (1.27m)
Contact Material - Post
Beryllium Copper
Housing Material
Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature
-

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