26-1518-11H

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Overview of 26-1518-11H

Part Number26-1518-11H
ManufacturerAries Electronics, Inc.
DescriptionCONN IC DIP SOCKET 26POS GOLD
DatasheetsDownload 26-1518-11H Datasheet PDFPDF Icon
Price for 26-1518-11H

Specification of 26-1518-11H

Status
Active
Series
518
Package
Bulk
Supplier
Aries Electronics
Type
DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid)
26 (2 x 13)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0in (0.25m)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
10.0in (0.25m)
Contact Material - Post
Brass
Housing Material
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature
-

Parts Information

Fields marked with a * are required
Part Number*ManufacturerDescriptionQuantity*Target Unit Price(USD)

Contact Information

Fields marked with a * are required

Introduction

26-1518-11H is in Stock, Find 26-1518-11H electronics components stock, Technical information, Inventory and Price here at Ic-find.com, send us an inquiry for 26-1518-11H to get the price and lead time now! We can offer fast shipment via DHL/FedEx/UPS.

Email us: [email protected] or RFQ 26-1518-11H Online.

FAQ

  • 1 How to place an order?[Click to Expand]

  • 2 What payment methods do you offer?[Click to Expand]

  • 3 How do you handle the shipment?[Click to Expand]

  • 4 I can't find a part on IC-find, what should I do?[Click to Expand]

Recommend Products

Your RFQ Preview

Fields marked with a * are required
Part Number*ManufacturerDescriptionQuantity*Target Unit Price(USD)
Continue Shopping
Go RFQ Page