32-823-90C

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Overview of 32-823-90C

Part Number32-823-90C
ManufacturerAries Electronics, Inc.
DescriptionCONN IC DIP SOCKET 32POS GOLD
DatasheetsDownload 32-823-90C Datasheet PDFPDF Icon
Price for 32-823-90C

Specification of 32-823-90C

Status
Active
Series
Vertisockets™ 800
Package
Bulk
Supplier
Aries Electronics
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
32 (2 x 16)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
30.0in (0.76m)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole, Right Angle, Horizontal
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
200.0in (5.08m)
Contact Material - Post
Brass
Housing Material
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature
-55C ~ 105C

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