36-3551-18

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Overview of 36-3551-18

Part Number36-3551-18
ManufacturerAries Electronics, Inc.
DescriptionCONN IC DIP SOCKET ZIF 36POS
Price for 36-3551-18

Specification of 36-3551-18

Status
Active
Series
55
Package
Bulk
Supplier
Aries Electronics
Type
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
36 (2 x 18)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Nickel Boron
Contact Finish Thickness - Mating
50.0in (1.27m)
Contact Material - Mating
Beryllium Nickel
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Nickel Boron
Contact Finish Thickness - Post
50.0in (1.27m)
Contact Material - Post
Beryllium Nickel
Housing Material
Polyetheretherketone (PEEK), Glass Filled
Operating Temperature
-55C ~ 250C

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