374324B60023G

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Overview of 374324B60023G

Part Number374324B60023G
ManufacturerAavid
DescriptionBGA HEAT SINK
DatasheetsDownload 374324B60023G Datasheet PDFPDF Icon
Price for 374324B60023G

Specification of 374324B60023G

Status
Active
Series
37432
Package
Bulk
Supplier
Aavid, Thermal Division of Boyd Corporation
Type
Board Level
Package Cooled
BGA, FPGA
Attachment Method
Solder Anchor
Shape
Square, Pin Fins
Length
1.063" (27.00mm)
Width
1.063" (27.00mm)
Diameter
-
Fin Height
0.394" (10.00mm)
Power Dissipation @ Temperature Rise
1.5W @ 50C
Thermal Resistance @ Forced Air Flow
6.00C/W @ 500 LFM
Thermal Resistance @ Natural
30.60C/W
Material
Aluminum
Material Finish
Black Anodized

Parts Information

Fields marked with a * are required
Part Number*ManufacturerDescriptionQuantity*Target Unit Price(USD)

Contact Information

Fields marked with a * are required

Introduction

374324B60023G is in Stock, Find 374324B60023G electronics components stock, Technical information, Inventory and Price here at Ic-find.com, send us an inquiry for 374324B60023G to get the price and lead time now! We can offer fast shipment via DHL/FedEx/UPS.

Email us: [email protected] or RFQ 374324B60023G Online.

FAQ

  • 1 How to place an order?[Click to Expand]

  • 2 What payment methods do you offer?[Click to Expand]

  • 3 How do you handle the shipment?[Click to Expand]

  • 4 I can't find a part on IC-find, what should I do?[Click to Expand]

Recommend Products

Your RFQ Preview

Fields marked with a * are required
Part Number*ManufacturerDescriptionQuantity*Target Unit Price(USD)
Continue Shopping
Go RFQ Page