40-6553-11

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Overview of 40-6553-11

Part Number40-6553-11
ManufacturerAries Electronics, Inc.
DescriptionCONN IC DIP SOCKET ZIF 40POS
DatasheetsDownload 40-6553-11 Datasheet PDFPDF Icon
Price for 40-6553-11

Specification of 40-6553-11

Status
Active
Series
55
Package
Bulk
Supplier
Aries Electronics
Type
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
40 (2 x 20)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Nickel Boron
Contact Finish Thickness - Mating
50.0in (1.27m)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Nickel Boron
Contact Finish Thickness - Post
50.0in (1.27m)
Contact Material - Post
Beryllium Copper
Housing Material
Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature
-

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