44-6552-11

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Overview of 44-6552-11

Part Number44-6552-11
ManufacturerAries Electronics, Inc.
DescriptionCONN IC DIP SOCKET ZIF 44POS GLD
DatasheetsDownload 44-6552-11 Datasheet PDFPDF Icon
Price for 44-6552-11

Specification of 44-6552-11

Status
Active
Series
55
Package
Bulk
Supplier
Aries Electronics
Type
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
44 (2 x 22)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
-
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
-
Contact Material - Post
Beryllium Copper
Housing Material
Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature
-

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