514-83-500M30-001148

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Overview of 514-83-500M30-001148

Part Number514-83-500M30-001148
ManufacturerPreci-Dip
DescriptionCONN SOCKET BGA 500POS GOLD
DatasheetsDownload 514-83-500M30-001148 Datasheet PDFPDF Icon
Price for 514-83-500M30-001148

Specification of 514-83-500M30-001148

Status
Active
Series
514
Package
Bulk
Supplier
Preci-Dip
Type
BGA
Number of Positions or Pins (Grid)
500 (30 x 30)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
29.5in (0.75m)
Contact Material - Mating
Beryllium Copper
Mounting Type
Surface Mount
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
-
Contact Material - Post
Brass
Housing Material
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature
-55C ~ 125C

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