558-10-356M26-001101

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Overview of 558-10-356M26-001101

Part Number558-10-356M26-001101
ManufacturerPreci-Dip
DescriptionPGA SOLDER TAIL 1.27MM
DatasheetsDownload 558-10-356M26-001101 Datasheet PDFPDF Icon
Price for 558-10-356M26-001101

Specification of 558-10-356M26-001101

Status
Active
Series
558
Package
Bulk
Supplier
Preci-Dip
Type
PGA
Number of Positions or Pins (Grid)
356 (26 x 26)
Pitch - Mating
0.050" (1.27mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0in (0.25m)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.050" (1.27mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
10.0in (0.25m)
Contact Material - Post
Brass
Housing Material
FR4 Epoxy Glass
Operating Temperature
-55C ~ 125C

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