833900T00000

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Overview of 833900T00000

Part Number833900T00000
ManufacturerComair Rotron
DescriptionHEATSINK STAMP 25.9X15X9.5MM
DatasheetsDownload 833900T00000 Datasheet PDFPDF Icon
Price for 833900T00000

Specification of 833900T00000

Status
Obsolete
Package
Bulk
Supplier
Comair Rotron
Type
Board Level
Package Cooled
TO-263 (DPak)
Attachment Method
SMD Pad
Shape
Rectangular, Fins
Length
0.591" (15.00mm)
Width
1.020" (25.91mm)
Diameter
-
Fin Height
0.375" (9.52mm)
Power Dissipation @ Temperature Rise
2.0W @ 40C
Thermal Resistance @ Forced Air Flow
5.00C/W @ 400 LFM
Thermal Resistance @ Natural
-
Material
Copper
Material Finish
Tin

Parts Information

Fields marked with a * are required
Part Number*ManufacturerDescriptionQuantity*Target Unit Price(USD)

Contact Information

Fields marked with a * are required

Introduction

833900T00000 is in Stock, Find 833900T00000 electronics components stock, Technical information, Inventory and Price here at Ic-find.com, send us an inquiry for 833900T00000 to get the price and lead time now! We can offer fast shipment via DHL/FedEx/UPS.

Email us: [email protected] or RFQ 833900T00000 Online.

FAQ

  • 1 How to place an order?[Click to Expand]

  • 2 What payment methods do you offer?[Click to Expand]

  • 3 How do you handle the shipment?[Click to Expand]

  • 4 I can't find a part on IC-find, what should I do?[Click to Expand]

Recommend Products

Your RFQ Preview

Fields marked with a * are required
Part Number*ManufacturerDescriptionQuantity*Target Unit Price(USD)
Continue Shopping
Go RFQ Page