APF30-30-10CB

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Overview of APF30-30-10CB

Part NumberAPF30-30-10CB
ManufacturerCTS Corporation
DescriptionHEATSINK LOW-PROFILE FORGED
DatasheetsDownload APF30-30-10CB Datasheet PDFPDF Icon
Price for APF30-30-10CB

Specification of APF30-30-10CB

Status
Active
Series
APF
Package
Box
Supplier
CTS Thermal Management Products
Type
Top Mount
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Shape
Square, Fins
Length
1.181" (30.00mm)
Width
1.181" (30.00mm)
Diameter
-
Fin Height
0.370" (9.40mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
3.30C/W @ 200 LFM
Thermal Resistance @ Natural
-
Material
Aluminum
Material Finish
Black Anodized

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