BDN09-3CB

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Overview of BDN09-3CB

Part NumberBDN09-3CB
ManufacturerCTS Corporation
DescriptionHEATSINK CPU .91" SQ
Price for BDN09-3CB

Specification of BDN09-3CB

Status
Active
Series
BDN
Package
Box
Supplier
CTS Thermal Management Products
Type
Top Mount
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Shape
Square, Pin Fins
Length
0.910" (23.11mm)
Width
0.910" (23.11mm)
Diameter
-
Fin Height
0.355" (9.02mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
9.60C/W @ 400 LFM
Thermal Resistance @ Natural
26.90C/W
Material
Aluminum
Material Finish
Black Anodized

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