DIP600T300P08

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Overview of DIP600T300P08

Part NumberDIP600T300P08
ManufacturerChip Quik, Inc.
DescriptionDIP-8 (0.6" BODY) TO DIP-8 (0.3"
DatasheetsDownload DIP600T300P08 Datasheet PDFPDF Icon
Price for DIP600T300P08

Specification of DIP600T300P08

Status
Active
Series
Proto-Advantage
Package
Bulk
Supplier
Chip Quik Inc.
Proto Board Type
DIP to DIP
Package Accepted
-
Number of Positions
8
Pitch
0.100" (2.54mm)
Board Thickness
0.063" (1.60mm)
Material
FR4 Epoxy Glass
Size / Dimension
0.700" L x 0.400" W (17.78mm x 10.16mm)

Parts Information

Fields marked with a * are required
Part Number*ManufacturerDescriptionQuantity*Target Unit Price(USD)

Contact Information

Fields marked with a * are required

Introduction

DIP600T300P08 is in Stock, Find DIP600T300P08 electronics components stock, Technical information, Inventory and Price here at Ic-find.com, send us an inquiry for DIP600T300P08 to get the price and lead time now! We can offer fast shipment via DHL/FedEx/UPS.

Email us: [email protected] or RFQ DIP600T300P08 Online.

FAQ

  • 1 How to place an order?[Click to Expand]

  • 2 What payment methods do you offer?[Click to Expand]

  • 3 How do you handle the shipment?[Click to Expand]

  • 4 I can't find a part on IC-find, what should I do?[Click to Expand]

Recommend Products

Your RFQ Preview

Fields marked with a * are required
Part Number*ManufacturerDescriptionQuantity*Target Unit Price(USD)
Continue Shopping
Go RFQ Page