HSB27-434316

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Overview of HSB27-434316

Part NumberHSB27-434316
ManufacturerCUI Devices
DescriptionHEAT SINK, BGA, 43.1 X 43.1 X 16
DatasheetsDownload HSB27-434316 Datasheet PDFPDF Icon
Price for HSB27-434316

Specification of HSB27-434316

Status
Active
Series
HSB
Package
Box
Supplier
CUI Devices
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive
Shape
Square, Pin Fins
Length
1.697" (43.10mm)
Width
1.697" (43.10mm)
Diameter
-
Fin Height
0.650" (16.51mm)
Power Dissipation @ Temperature Rise
8.98W @ 75C
Thermal Resistance @ Forced Air Flow
2.80C/W @ 200 LFM
Thermal Resistance @ Natural
8.35C/W
Material
Aluminum Alloy
Material Finish
Black Anodized

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