HSS08-B18-CP

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Overview of HSS08-B18-CP

Part NumberHSS08-B18-CP
ManufacturerCUI Devices
DescriptionHEAT SINK, STAMPING, TO-218, 44.
DatasheetsDownload HSS08-B18-CP Datasheet PDFPDF Icon
Price for HSS08-B18-CP

Specification of HSS08-B18-CP

Status
Active
Series
HSS
Package
Box
Supplier
CUI Devices
Type
Board Level, Vertical
Package Cooled
TO-218
Attachment Method
PC Pin
Shape
Square
Length
1.750" (44.45mm)
Width
1.750" (44.45mm)
Diameter
-
Fin Height
0.492" (12.50mm)
Power Dissipation @ Temperature Rise
10.3W @ 75C
Thermal Resistance @ Forced Air Flow
3.50C/W @ 200 LFM
Thermal Resistance @ Natural
7.29C/W
Material
Aluminum Alloy
Material Finish
Black Anodized

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