HSS25-B20-P51

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Overview of HSS25-B20-P51

Part NumberHSS25-B20-P51
ManufacturerCUI Devices
DescriptionHEAT SINK, STAMPING, TO-218/TO-2
DatasheetsDownload HSS25-B20-P51 Datasheet PDFPDF Icon
Price for HSS25-B20-P51

Specification of HSS25-B20-P51

Status
Active
Series
HSS
Package
Box
Supplier
CUI Devices
Type
Board Level
Package Cooled
TO-218, TO-220
Attachment Method
PC Pin
Shape
Square, Fins
Length
1.000" (25.40mm)
Width
1.000" (25.40mm)
Diameter
-
Fin Height
1.673" (42.50mm)
Power Dissipation @ Temperature Rise
5.88W @ 75C
Thermal Resistance @ Forced Air Flow
6.30C/W @ 200 LFM
Thermal Resistance @ Natural
12.75C/W
Material
Aluminum Alloy
Material Finish
Black Anodized

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