JET551AX30T5

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Overview of JET551AX30T5

Part NumberJET551AX30T5
ManufacturerChip Quik, Inc.
DescriptionJET PRINTING SOLDER PASTE SN63/P
DatasheetsDownload JET551AX30T5 Datasheet PDFPDF Icon
Price for JET551AX30T5

Specification of JET551AX30T5

Status
Active
Series
CHIPQUIK®
Package
Bulk
Supplier
Chip Quik Inc.
Type
Solder Paste
Composition
Sn63Pb37 (63/37)
Diameter
-
Melting Point
361F (183C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
-
Process
Leaded
Form
Syringe, 3.53 oz (100g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
-

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