MS05

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Overview of MS05

Part NumberMS05
ManufacturerApex Microtechnology
DescriptionCONN IC DIP SOCKET 12POS GOLD
Price for MS05

Specification of MS05

Status
Discontinued at Digi-Key
Series
Apex Precision Power®
Package
Bulk
Type
DIP, 1.2"" (30.48mm) Row Spacing
Number of Positions or Pins (Grid)
12 (2 x 6)
Pitch - Mating
0.100"" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
30.0µin (0.76µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100"" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Brass
Housing Material
Polyester, Glass Filled
Operating Temperature
-
Termination Post Length
0.270"" (6.86mm)
Material Flammability Rating
UL94 V-0
Contact Resistance
-

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Introduction

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