NC191LTA35

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Overview of NC191LTA35

Part NumberNC191LTA35
ManufacturerChip Quik, Inc.
DescriptionSMOOTH FLOW LOW TEMP SOLDER PAST
DatasheetsDownload NC191LTA35 Datasheet PDFPDF Icon
Price for NC191LTA35

Specification of NC191LTA35

Status
Active
Series
Smooth Flow™
Package
Bulk
Supplier
Chip Quik Inc.
Type
Solder Paste
Composition
Bi57Sn42Ag1 (57/42/1)
Diameter
-
Melting Point
279F (137C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
-
Form
Syringe, 1.23 oz (35g), 10cc
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37F ~ 46F (3C ~ 8C)

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