PA0171

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Overview of PA0171

Part NumberPA0171
ManufacturerChip Quik, Inc.
DescriptionMINI SOIC-10 EXP PAD TO DIP-10 S
DatasheetsDownload PA0171 Datasheet PDFPDF Icon
Price for PA0171

Specification of PA0171

Status
Active
Series
Proto-Advantage
Package
Bulk
Supplier
Chip Quik Inc.
Proto Board Type
SMD to DIP
Package Accepted
MiniSOIC EP
Number of Positions
10
Pitch
0.020" (0.50mm)
Board Thickness
0.062" (1.57mm) 1/16"
Material
FR4 Epoxy Glass
Size / Dimension
0.700" x 0.500" (17.78mm x 12.70mm)

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Introduction

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