SMD291SNL60T4

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Overview of SMD291SNL60T4

Part NumberSMD291SNL60T4
ManufacturerChip Quik, Inc.
DescriptionSN96.5/AG3.0/CU0.5 2-PRT MIX 60G
DatasheetsDownload SMD291SNL60T4 Datasheet PDFPDF Icon
Price for SMD291SNL60T4

Specification of SMD291SNL60T4

Status
Active
Package
Jar
Supplier
Chip Quik Inc.
Type
Solder Paste, Two Part Mix
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423 ~ 428F (217 ~ 220C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Lead Free
Form
Jar, 2.12 oz (60g)
Shelf Life
24 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37F ~ 77F (3C ~ 25C)

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