SMDLTLFP500T3

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Overview of SMDLTLFP500T3

Part NumberSMDLTLFP500T3
ManufacturerChip Quik, Inc.
DescriptionSOLDER PASTE SN42/BI58 500G
DatasheetsDownload SMDLTLFP500T3 Datasheet PDFPDF Icon
Price for SMDLTLFP500T3

Specification of SMDLTLFP500T3

Status
Active
Package
Jar
Supplier
Chip Quik Inc.
Type
Solder Paste
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter
-
Melting Point
281F (138C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
3
Process
Lead Free
Form
Jar, 17.64 oz (500g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37F ~ 46F (3C ~ 8C)

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