TS391SNL50

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Overview of TS391SNL50

Part NumberTS391SNL50
ManufacturerChip Quik, Inc.
DescriptionTHERMALLY STABLE SOLDER PASTE NO
DatasheetsDownload TS391SNL50 Datasheet PDFPDF Icon
Price for TS391SNL50

Specification of TS391SNL50

Status
Active
Package
Bulk
Supplier
Chip Quik Inc.
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423 ~ 428F (217 ~ 220C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Lead Free
Form
Jar, 1.76 oz (50g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
68F ~ 77F (20C ~ 25C)

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