TS991SNL500T4

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Overview of TS991SNL500T4

Part NumberTS991SNL500T4
ManufacturerChip Quik, Inc.
DescriptionSOLDER PASTE THERMALLY STABLE NC
DatasheetsDownload TS991SNL500T4 Datasheet PDFPDF Icon
Price for TS991SNL500T4

Specification of TS991SNL500T4

Status
Active
Series
CHIPQUIK®
Package
Bulk
Supplier
Chip Quik Inc.
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423F (217C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Lead Free
Form
Jar, 17.64 oz (500g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
-

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