W66BM6NBUAFJ

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Overview of W66BM6NBUAFJ

Part NumberW66BM6NBUAFJ
ManufacturerWinbond Electronics Corporation
DescriptionIC DRAM 2GBIT LVSTL 11 200WFBGA
DatasheetsDownload W66BM6NBUAFJ Datasheet PDFPDF Icon
Price for W66BM6NBUAFJ

Specification of W66BM6NBUAFJ

Status
Not For New Designs
Package
Tray
Supplier
Winbond Electronics
Digi-Key Programmable
Not Verified
Memory Type
Volatile
Memory Format
DRAM
Technology
SDRAM - Mobile LPDDR4X
Memory Size
2Gbit
Memory Organization
128M x 16
Memory Interface
LVSTL_11
Clock Frequency
1.6 GHz
Write Cycle Time - Word, Page
18ns
Access Time
3.5 ns
Voltage - Supply
1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature
-40C ~ 105C (TC)
Mounting Type
Surface Mount
Package / Case
200-WFBGA
Supplier Device Package
200-WFBGA (10x14.5)

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