XR2D-4001-N

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Overview of XR2D-4001-N

Part NumberXR2D-4001-N
ManufacturerOmron Electronics Components
DescriptionCONN IC DIP SOCKET 40POS GOLD
DatasheetsDownload XR2D-4001-N Datasheet PDFPDF Icon
Price for XR2D-4001-N

Specification of XR2D-4001-N

Status
Obsolete
Series
XR2
Package
Bulk
Supplier
Omron Electronics Inc-EMC Div
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
40 (2 x 20)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
29.5in (0.75m)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Carrier
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
29.5in (0.75m)
Contact Material - Post
Beryllium Copper
Housing Material
Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature
-55C ~ 125C

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