APF19-19-13CB

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Overview of APF19-19-13CB

Part NumberAPF19-19-13CB
ManufacturerCTS Corporation
DescriptionHEATSINK LOW-PROFILE FORGED
DatasheetsDownload APF19-19-13CB Datasheet PDFPDF Icon
Price for APF19-19-13CB

Specification of APF19-19-13CB

Status
Active
Series
APF
Package
Box
Supplier
CTS Thermal Management Products
Type
Top Mount
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Shape
Square, Fins
Length
0.748" (19.00mm)
Width
0.748" (19.00mm)
Diameter
-
Fin Height
0.500" (12.70mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
4.00C/W @ 200 LFM
Thermal Resistance @ Natural
-
Material
Aluminum
Material Finish
Black Anodized

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