DIP300T600P08

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Overview of DIP300T600P08

Part NumberDIP300T600P08
ManufacturerChip Quik, Inc.
DescriptionDIP-8 (0.3" BODY) TO DIP-8 (0.6"
DatasheetsDownload DIP300T600P08 Datasheet PDFPDF Icon
Price for DIP300T600P08

Specification of DIP300T600P08

Status
Active
Series
Proto-Advantage
Package
Bulk
Supplier
Chip Quik Inc.
Proto Board Type
DIP to DIP
Package Accepted
-
Number of Positions
8
Pitch
0.100" (2.54mm)
Board Thickness
0.063" (1.60mm)
Material
FR4 Epoxy Glass
Size / Dimension
0.700" L x 0.400" W (17.78mm x 10.16mm)

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