DIP316-001BLF

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Overview of DIP316-001BLF

Part NumberDIP316-001BLF
ManufacturerAmphenol Information Communication & Commercial
DescriptionCONN IC DIP SOCKET 16POS GOLD
Price for DIP316-001BLF

Specification of DIP316-001BLF

Status
Obsolete
Package
Bag
Supplier
Amphenol CS (FCI)
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
16 (2 x 8)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
30.0in (0.76m)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
200.0in (5.08m)
Contact Material - Post
Brass
Housing Material
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature
-

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