HSB26-343408

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Overview of HSB26-343408

Part NumberHSB26-343408
ManufacturerCUI Devices
DescriptionHEAT SINK, BGA, 33.5 X 33.5 X 8
DatasheetsDownload HSB26-343408 Datasheet PDFPDF Icon
Price for HSB26-343408

Specification of HSB26-343408

Status
Active
Series
HSB
Package
Box
Supplier
CUI Devices
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive
Shape
Square, Pin Fins
Length
1.319" (33.50mm)
Width
1.319" (33.50mm)
Diameter
-
Fin Height
0.315" (8.00mm)
Power Dissipation @ Temperature Rise
4.94W @ 75C
Thermal Resistance @ Forced Air Flow
5.30C/W @ 200 LFM
Thermal Resistance @ Natural
15.19C/W
Material
Aluminum Alloy
Material Finish
Black Anodized

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