PA0170-S

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Overview of PA0170-S

Part NumberPA0170-S
ManufacturerChip Quik, Inc.
DescriptionMINI SOIC-8 EXP PAD STENCIL
DatasheetsDownload PA0170-S Datasheet PDFPDF Icon
Price for PA0170-S

Specification of PA0170-S

Status
Active
Series
Proto-Advantage PA
Package
Bulk
Supplier
Chip Quik Inc.
Type
Mini SOIC
Number of Positions
8
Pitch
0.026" (0.65mm)
Outer Dimension
1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension
0.118" L x 0.118" W (3.00mm x 3.00mm)
Thermal Center Pad
0.315" L x 0.067" W (8.00mm x 1.70mm)
Material
Stainless Steel

Parts Information

Fields marked with a * are required
Part Number*ManufacturerDescriptionQuantity*Target Unit Price(USD)

Contact Information

Fields marked with a * are required

Introduction

PA0170-S is in Stock, Find PA0170-S electronics components stock, Technical information, Inventory and Price here at Ic-find.com, send us an inquiry for PA0170-S to get the price and lead time now! We can offer fast shipment via DHL/FedEx/UPS.

Email us: [email protected] or RFQ PA0170-S Online.

FAQ

  • 1 How to place an order?[Click to Expand]

  • 2 What payment methods do you offer?[Click to Expand]

  • 3 How do you handle the shipment?[Click to Expand]

  • 4 I can't find a part on IC-find, what should I do?[Click to Expand]

Recommend Products

Your RFQ Preview

Fields marked with a * are required
Part Number*ManufacturerDescriptionQuantity*Target Unit Price(USD)
Continue Shopping
Go RFQ Page