SMD291SNL50T3

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Overview of SMD291SNL50T3

Part NumberSMD291SNL50T3
ManufacturerChip Quik, Inc.
DescriptionSLDR PASTE NO-CLN SAC305 50G
DatasheetsDownload SMD291SNL50T3 Datasheet PDFPDF Icon
Price for SMD291SNL50T3

Specification of SMD291SNL50T3

Status
Active
Package
Jar
Supplier
Chip Quik Inc.
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423 ~ 428F (217 ~ 220C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
3
Process
Lead Free
Form
Jar, 1.76 oz (50g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37F ~ 46F (3C ~ 8C)

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