SMDLTLFP250T4

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Overview of SMDLTLFP250T4

Part NumberSMDLTLFP250T4
ManufacturerChip Quik, Inc.
DescriptionSOLDER PASTE LOW TEMP T4 250G
DatasheetsDownload SMDLTLFP250T4 Datasheet PDFPDF Icon
Price for SMDLTLFP250T4

Specification of SMDLTLFP250T4

Status
Active
Package
Jar
Supplier
Chip Quik Inc.
Type
Solder Paste
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter
-
Melting Point
281F (138C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Lead Free
Form
Jar, 8.8 oz (250g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37F ~ 46F (3C ~ 8C)

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