TS391SNL10

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Overview of TS391SNL10

Part NumberTS391SNL10
ManufacturerChip Quik, Inc.
DescriptionTHERMALLY STABLE SOLDER PASTE NO
DatasheetsDownload TS391SNL10 Datasheet PDFPDF Icon
Price for TS391SNL10

Specification of TS391SNL10

Status
Active
Package
Bulk
Supplier
Chip Quik Inc.
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423 ~ 428F (217 ~ 220C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Lead Free
Form
Syringe, 1.23 oz (35g), 10cc
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
68F ~ 77F (20C ~ 25C)

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