TS991SNL500T3

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Overview of TS991SNL500T3

Part NumberTS991SNL500T3
ManufacturerChip Quik, Inc.
DescriptionSOLDER PASTE THERMALLY STABLE NC
DatasheetsDownload TS991SNL500T3 Datasheet PDFPDF Icon
Price for TS991SNL500T3

Specification of TS991SNL500T3

Status
Active
Series
CHIPQUIK®
Package
Bulk
Supplier
Chip Quik Inc.
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423F (217C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
3
Process
Lead Free
Form
Jar, 17.64 oz (500g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
-

Parts Information

Fields marked with a * are required
Part Number*ManufacturerDescriptionQuantity*Target Unit Price(USD)

Contact Information

Fields marked with a * are required

Introduction

TS991SNL500T3 is in Stock, Find TS991SNL500T3 electronics components stock, Technical information, Inventory and Price here at Ic-find.com, send us an inquiry for TS991SNL500T3 to get the price and lead time now! We can offer fast shipment via DHL/FedEx/UPS.

Email us: [email protected] or RFQ TS991SNL500T3 Online.

FAQ

  • 1 How to place an order?[Click to Expand]

  • 2 What payment methods do you offer?[Click to Expand]

  • 3 How do you handle the shipment?[Click to Expand]

  • 4 I can't find a part on IC-find, what should I do?[Click to Expand]

Recommend Products

Your RFQ Preview

Fields marked with a * are required
Part Number*ManufacturerDescriptionQuantity*Target Unit Price(USD)
Continue Shopping
Go RFQ Page