Recently, media reports indicate that Samsung Electronics announced during its latest earnings call that the future focus of its memory business will shift away from consumer PCs and mobile devices, moving towards enterprise sectors such as HBM (High Bandwidth Memory), DDR5 server memory, and enterprise-grade SSDs.

Samsung's Vice President of Memory Business, Kim Jae-june, revealed during the call that the company plans to increase the supply of HBM chips by more than three times by the end of this year compared to last year, with production set to double again by 2025.

Driven by the AI boom, the demand for HBM continues to surge, with some manufacturers stating that their HBM products for this year are already sold out, and some even indicating that next year's HBM supply is also fully booked.

In this context, Samsung's strategic shift to focus on high-value products like HBM seems logical.

Additionally, reports indicate that Samsung has assembled a new team of HBM engineers to secure multi-billion-dollar contracts from NVIDIA. This new task force comprises about 100 top engineers dedicated to enhancing manufacturing yield and quality, with the primary goal of passing NVIDIA's tests.

Furthermore, to bolster its HBM competitiveness, Samsung has reportedly implemented a "dual-track" restructuring of its HBM memory development department. The existing DRAM design team is responsible for the ongoing development of HBM3E memory, while the HBM capacity and quality improvement team, established in March of this year, focuses on developing HBM4. Industry insiders believe Samsung is likely to begin mass production of HBM4 by 2026.