HSB25-282810

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Overview of HSB25-282810

Part NumberHSB25-282810
ManufacturerCUI Devices
DescriptionHEAT SINK, BGA, 28.5 X 28.5 X 10
DatasheetsDownload HSB25-282810 Datasheet PDFPDF Icon
Price for HSB25-282810

Specification of HSB25-282810

Status
Active
Series
HSB
Package
Box
Supplier
CUI Devices
Type
Top Mount
Package Cooled
BGA
Attachment Method
Push Pin
Shape
Square, Pin Fins
Length
1.122" (28.50mm)
Width
1.122" (28.50mm)
Diameter
-
Fin Height
0.394" (10.00mm)
Power Dissipation @ Temperature Rise
4.87W @ 75C
Thermal Resistance @ Forced Air Flow
5.10C/W @ 200 LFM
Thermal Resistance @ Natural
15.41C/W
Material
Aluminum Alloy
Material Finish
Black Anodized

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