SMD291SNL500T3

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Overview of SMD291SNL500T3

Part NumberSMD291SNL500T3
ManufacturerChip Quik, Inc.
DescriptionSOLDER PASTE SAC305 500G
DatasheetsDownload SMD291SNL500T3 Datasheet PDFPDF Icon
Price for SMD291SNL500T3

Specification of SMD291SNL500T3

Status
Active
Package
Jar
Supplier
Chip Quik Inc.
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423 ~ 428F (217 ~ 220C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
3
Process
Lead Free
Form
Jar, 17.64 oz (500g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37F ~ 46F (3C ~ 8C)

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