TS391LT250

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Overview of TS391LT250

Part NumberTS391LT250
ManufacturerChip Quik, Inc.
DescriptionTHERMALLY STABLE SOLDER PASTE NO
DatasheetsDownload TS391LT250 Datasheet PDFPDF Icon
Price for TS391LT250

Specification of TS391LT250

Status
Active
Package
Bulk
Supplier
Chip Quik Inc.
Type
Solder Paste
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter
-
Melting Point
281F (138C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Lead Free
Form
Jar, 8.8 oz (250g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
68F ~ 77F (20C ~ 25C)

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