TS991SNL35T3

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Overview of TS991SNL35T3

Part NumberTS991SNL35T3
ManufacturerChip Quik, Inc.
DescriptionTHERMALLY STABLE SOLDER PASTE NC
DatasheetsDownload TS991SNL35T3 Datasheet PDFPDF Icon
Price for TS991SNL35T3

Specification of TS991SNL35T3

Status
Active
Series
CHIPQUIK®
Package
Bulk
Supplier
Chip Quik Inc.
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423F (217C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
3
Process
-
Form
Syringe, 1.23 oz (34.869g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37F ~ 77F (3C ~ 25C)

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