HSB24-252510

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Overview of HSB24-252510

Part NumberHSB24-252510
ManufacturerCUI Devices
DescriptionHEAT SINK, BGA,25 X 25 X 10 MM
DatasheetsDownload HSB24-252510 Datasheet PDFPDF Icon
Price for HSB24-252510

Specification of HSB24-252510

Status
Active
Series
HSB
Package
Box
Supplier
CUI Devices
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive
Shape
Square, Pin Fins
Length
0.984" (25.00mm)
Width
0.984" (25.00mm)
Diameter
-
Fin Height
0.394" (10.00mm)
Power Dissipation @ Temperature Rise
4.14W @ 75C
Thermal Resistance @ Forced Air Flow
6.50C/W @ 200 LFM
Thermal Resistance @ Natural
18.10C/W
Material
Aluminum Alloy
Material Finish
Black Anodized

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