HSB23-232325

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Overview of HSB23-232325

Part NumberHSB23-232325
ManufacturerCUI Devices
DescriptionHEAT SINK, BGA, 23 X 23 X 25 MM
DatasheetsDownload HSB23-232325 Datasheet PDFPDF Icon
Price for HSB23-232325

Specification of HSB23-232325

Status
Active
Series
HSB
Package
Box
Supplier
CUI Devices
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive
Shape
Square, Pin Fins
Length
0.906" (23.00mm)
Width
0.906" (23.00mm)
Diameter
-
Fin Height
0.984" (25.00mm)
Power Dissipation @ Temperature Rise
6.13W @ 75C
Thermal Resistance @ Forced Air Flow
3.80C/W @ 200 LFM
Thermal Resistance @ Natural
12.23C/W
Material
Aluminum Alloy
Material Finish
Black Anodized

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