HSB03-141406

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Overview of HSB03-141406

Part NumberHSB03-141406
ManufacturerCUI Devices
DescriptionHEAT SINK, BGA, 14 X 14 X 6 MM
DatasheetsDownload HSB03-141406 Datasheet PDFPDF Icon
Price for HSB03-141406

Specification of HSB03-141406

Status
Active
Series
HSB
Package
Box
Supplier
CUI Devices
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive
Shape
Square, Pin Fins
Length
0.551" (14.00mm)
Width
0.551" (14.00mm)
Diameter
-
Fin Height
0.236" (6.00mm)
Power Dissipation @ Temperature Rise
2.1W @ 75C
Thermal Resistance @ Forced Air Flow
15.80C/W @ 200 LFM
Thermal Resistance @ Natural
35.98C/W
Material
Aluminum Alloy
Material Finish
Black Anodized

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