HSB11-252518

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Overview of HSB11-252518

Part NumberHSB11-252518
ManufacturerCUI Devices
DescriptionHEAT SINK, BGA, 25 X 25 X 18 MM
DatasheetsDownload HSB11-252518 Datasheet PDFPDF Icon
Price for HSB11-252518

Specification of HSB11-252518

Status
Active
Series
HSB
Package
Box
Supplier
CUI Devices
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive
Shape
Square, Pin Fins
Length
0.984" (25.00mm)
Width
0.984" (25.00mm)
Diameter
-
Fin Height
0.709" (18.00mm)
Power Dissipation @ Temperature Rise
5.5W @ 75C
Thermal Resistance @ Forced Air Flow
4.50C/W @ 200 LFM
Thermal Resistance @ Natural
13.70C/W
Material
Aluminum Alloy
Material Finish
Black Anodized

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